Saito Seiki Co., Ltd. Solar Cell Wafer Separation Device
The person improved the 5% crack that was occurring during peeling to within 3%.
In recent years, the solar power generation industry has seen a dramatic increase in production numbers due to the "public support systems" associated with the ecology boom. However, there are still many processes where companies have not established their production methods, and numerous processes remain untouched by automation. Saito Seiki Co., Ltd. has successfully automated processes that must rely on human labor. This involves the manual peeling of each individual wafer that sticks together after silicon cutting. After peeling, the wafers undergo cleaning and PVD treatment to be completed as solar cell units. The silicon after cutting is very thin, ranging from 160 to 180 micrometers, and has weak strength, making it prone to breaking like a pie. Therefore, the wafers are currently being peeled one by one, relying on the spacing of human hands. Thanks to the peeling technology for thin-film products, we can expand into various fields such as thin-film products, thin-film display devices, and membrane optical devices. For more details, please contact us or refer to our catalog.
- Company：斎藤精機
- Price：Other
